Thermal Interface Material Grease

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Thermal interface material grease. Aoki r and chiu c p a testing apparatus for thermal interface materials proceedings of 1998 international symposium on microelectronics san. Henkel s hi flow phase change materials are not only an effective alternative for thermal greases their thixotropic characteristics ensure they are solid at room temperature and won t flow out of an interface at operational temperature. That s why thermal interface materials are becoming such an important technology in the electronics industry. As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and.

They exhibit outstanding thermal conductivity because they fit snugly in the gap between the heat generating. To learn more about henkel s line of thermal grease alternatives click here. Thermal paste also called thermal compound thermal grease thermal interface material tim thermal gel heat paste heat sink compound heat sink paste or cpu grease is a thermally conductive but usually electrically insulating chemical compound which is commonly used as an interface between heat sinks and heat sources such as high power semiconductor devices.