Thermal Interface Material

Irvine california henkel today announced the expansion of its award winning thermal interface materials tims portfolio with the addition of a product developed to address the high power density challenges associated with new 5g telecom infrastructure and consumer mobility designs.

Thermal interface material. Thermal interface material tim is a material that is used to transfer heat between two substrates. Thermal interface materials the dissipation of heat is the key to maintaining longevity and reliability of semiconductor and power devices. As an industry leader in high performance cost effective thermal interface materials tims and technologies laird designs and manufactures thermal products including gap fillers and putties phase change materials thermal greases and thermally conductive insulator materials that meet the demands interface materials tims and technologies laird designs and. Aoki r and chiu c p a testing apparatus for thermal interface materials proceedings of 1998 international symposium on microelectronics san.

Egraf hitherm thermal interface materials tims are designed for long life mission critical applications that have extreme heat cycles. Honeywell tims are based on proprietary technologies of polymer matrices and thermally conductive fillers enabling them to handle challenging heat dissipation issues. Thermal interface materials provide a thermal path between the heat source and heat sink. Thermal interface materials are designed to help remove the heat generated by an electronic device to the ambient environment to ensure reliable operation of electronic hardware communication equipment and portable electronics.

A thermal interface material shortened to tim is any material that is inserted between two components in order to enhance the thermal coupling between them a common use is heat dissipation in which the tim is inserted between a heat producing device e g. And matayabas j thermal contact resistance of cured gel polymeric thermal interface material submitted to ieee transactions on components and packaging technology 2003. Thermal interface materials tims are widely employed to manufacture the most critical parts in the heat dissipation system to cool and protect integrated circuit ic chips. Indium corporation is a leader in the development of both solder and metal based thermal interface materials tim for a wide variety of applications.

Hitherm tims are made of flexible graphite specifically engineered for demanding lighting computing and power electronics applications. While the surfaces to be placed in contact may appear flat closer inspection will show imperfections such as tool marks warped or imperfectly flat surfaces surface.